 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| EMIF10-1K010F2 10-line IPADTM, EMI filter including ESD protection Features EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead free package Very low PCB space consuming: 2.42 mm x 2.42 mm Very thin package: 0.650 mm High efficiency in ESD suppression on both input and output pins (IEC 61000-4-2 level 4) High reliability offered by monolithic integration High reducing of parasitic elements through integration & wafer level packaging Flip Chip (24 bumps) Figure 1. Pin configuration (bump side) 5 I7 I9 I10 09 4 GND 3 GND 2 I3 I5 I4 03 04 1 A I1 I2 01 02 Complies with the following standards: IEC 61000-4-2 level 4 - 15 kV (air discharge) - 8 kV (contact discharge) MIL STD 883F - Method 3015.7 Class 3 GND GND B C D E I8 07 08 I6 05 06 Applications Where EMI filtering in ESD sensitive equipment is required: 010 Mobile Phones Computers and printers Communication systems MCU Boards Figure 2. Basic cell configuration Low pass filter Input Output Description The EMIF10-1K010F2 is a highly integrated device designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV. RI/O = 1 k Cline = 100 pF TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 4 1/8 www.st.com 8 Characteristics EMIF10-1K010F2 1 Characteristics Table 1. Symbol Absolute ratings (Tamb = 25 C) Parameter and test conditions ESD discharge IEC 61000-4-2 - Air discharge - Contact discharge MIL STD 883F - Method 3015.7 Class 3 Junction temperature Operating temperature range Storage temperature range Value Unit VPP 15 8 25 125 - 40 to + 85 - 55 to + 150 kV Tj Top Tstg C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM Rd RI/O Cline Electrical characteristics (Tamb = 25 C) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Resistance between Input and Output Input capacitance per line Test conditions IR = 1 mA VRM = 3 V per line IPP = 10 A, tp = 2.5 s 900 F = 1 MHz VOSC = 30 mV Vline = 0 V 80 1 1000 100 1100 120 Min. 6 Typ. 8 Max. 10 200 Unit V nA pF IPP VBR VCL VRM IRM IR VF V I IF 2/8 EMIF10-1K010F2 Characteristics Figure 3. 0.00 dB - 10.00 S21(db) attenuation measurement Figure 4. Analog cross talk measurements - 20.00 - 30.00 - 40.00 - 50.00 1.0M 3.0M 10.0M 30.0M f/Hz 100.0M 300.0M 1.0G 3.0G Figure 5. Figure 6. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input (Vin) and on one output (Vout) INPUT ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input (Vin) and on one output (Vout) INPUT OUTPUT OUTPUT Figure 7. Capacitance versus reverse applied voltage C (pF) 120 Input / GND 100 80 60 40 20 VR (V) 0 0.0 1.0 2.0 3.0 4.0 5.0 3/8 Application information EMIF10-1K010F2 2 Application information Figure 8. Aplac model GNDi Rs Ls 50pH 50m Ii Oi 50pH 50m Ls Rs + Port15 - 50 Rgnd Lgnd + cap_line cap_line + Port16 50 + - Lbump Rbump Rgnd Lgnd Rgnd Lgnd Rgnd Lgnd Rseries Ii Oi Ii MODEL = demif10 GNDi MODEL = demif10 Oi Csubump Rsubump + cap_hole Lhole + sub Rsub Rhole Csubump Rsubump + sub Figure 9. Aplac parametersl Cz Rseries cap_line Ls Rbump Lbump Rs Csubump Rsubump Rsub lhole Rhole cap_hole Rgnd Ignd 57pF 960 0.8pF 0.6nH 50m 50pH 0.15 15pF 0.15 0.1 1.2nH opt 0.15 0.15pF 0.25 0.4nH Model demif10 BV = 7 IBV = 1m CJO = Cz M = 0.3333 Rs = 1 VJ = 0.6 TT = 100n 4/8 EMIF10-1K010F2 Ordering information scheme 3 Ordering information scheme Figure 10. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 100 (pF) or 3 letters = application 2 digits = version Package F = Flip Chip X = 2: lead-free pitch = 500 m, bump = 315 m yy - xxx zz Fx 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 11. Flip Chip package dimensions 500 m 50 500 m 50 310 m 50 650 m 65 210 m 2.39 mm 30 m 210 m 2.39 mm 30 m 250 m 40 5/8 Ordering information EMIF10-1K010F2 Figure 12. Footprint recommendations Figure 13. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 250 m recommended, 300 m max E Solder stencil opening: 330 m Solder mask opening recommendation: 340 m min for 310 m copper pad diameter xxz y ww Figure 14. Flip Chip tape and reel specification Dot identifying Pin A1 location 4 0.1 O 1.5 0.1 1.75 0.1 3.5 0.1 2.60 0.73 0.05 All dimensions in mm 8 0.3 ST E ST ST xxz yww User direction of unreeling xxz yww xxz yww 2.60 4 0.1 E E 5 Ordering information Table 3. Ordering information Marking FD Package Flip Chip Weight 7.9 mg Base qty 5000 Delivery mode Tape and reel Order code EMIF10-1K010F2 Note: More information is available in the application notes: AN1235: "Flip Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements 6/8 EMIF10-1K010F2 Revision history 6 Revision history Table 4. Date 12-Oct-2004 28-Aug-2006 18-Sep-2006 17-Apr-2008 Document revision history Revision 1 2 3 4 First issue. Die layout upgrade. Added pocket dimensions to Figure 11. Updated ECOPACK statement. Updated Figure 10, Figure 11, Figure 12. and Figure 14. Reformatted to current standards. Description of changes 7/8 EMIF10-1K010F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
Price & Availability of EMIF10-1K010F208
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |